Chinese smartphone brand Honor is set to redefine the foldable phone market with its upcoming launch, the Honor Magic V Flip, scheduled for July 2, 2025. Touted as the thinnest and lightest foldable smartphone ever, this device is expected to raise the bar in both design and performance.
Honor CEO James Li gave a sneak peek of the phone during the Mobile World Congress Shanghai 2025, revealing standout features that blend sleek aesthetics with powerful AI integration.
Powered by the Snapdragon 8 Elite processor, the Magic V Flip is optimized for gaming, multitasking, and advanced AI operations. It sports a 7.95-inch 2K+ LTPO foldable display and a 50MP main camera for premium photography. Fueling the device is a 6100mAh silicon-carbon battery with 66W fast charging support.
Compared to its predecessor, the Magic V3 (which had an unfolded thickness of 4.35mm), the V Flip promises an even more refined design and reduced weight for better portability.
Analysts believe the Magic V Flip is poised to directly compete with the upcoming Samsung Galaxy Z Fold 7, expected to launch around July 8. This head-to-head competition is expected to offer consumers more innovation and choices in the foldable market.
While pricing details remain undisclosed, it’s expected to be higher than previous models, reflecting its premium specs. The phone will launch in China first, followed by a global rollout.
